New anti-oxidation tin-lead solder

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New anti-oxidation tin-lead solder

Product Name: New anti-oxidation tin-lead solder
Executive Standard: GB/T8012-2000 or GB/T3131-2001
Physical properties: Solidus 183 ~ 185 ℃, liquid line 183 ~ 235 ℃, the resistivity 0.141 ~ 0.181 (Ω.mm2 / m)
The relative density of 8.4 ~ 9.3g/cm3
Main use: widely used in electronics, electrical, micro-technology, aviation industry; in the printing line, wave soldering, solder plating metal software, radiator dip soldering, cable joints, sheet metal, plumbing solder, cable, metal heat exchanger Equipment radiators, welding, etc. Can both applications.
Packing: carton packaging, each box of net weight 20 +0.2 KG, Carton size 305 × 205 × 60mm, or according to user requirement.

 

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